Image obtained from medescape.wordpress.com
Researchers at Clarkson University Centre for Advanced Materials Processing have developed a method for dental protection against cavities by grinding with ultrafine particles of silica.
In conducting this project, they adapted a polish technology used in the semiconductor industry to polish the roughness of the teeth at nanoscale. Roughness remaining in teeth after the refinement is a few nanometers.
This project’s contribution is not the use of silica for dental polishing used before but its nanoscale use.
According to the authors of this study, this technique is an effective preventive tool against bacteria responsible for the destruction of tooth enamel, which poses major problems of grip making it easier to eliminate the bacteria before they cause damage to the enamel.